학술대회자료
펨토초 레이저 건식세정에 의한 형광 나노입자 제거
Dry cleaning characteristic using removal of fluorescence particles on wafer by femtosecond laser shockwave
- 한국레이저가공학회
- 한국레이저가공학회 학술대회 논문집
- 2007년도 추계학술발표대회 논문집
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2007.1169 - 73 (5 pages)
- 18
Laser cleaning techniques have been used for silicon wafer due to high removal effectiveness with environment-friendly process. The plasma shockwave is main effect of femtosecond laser cleaning to remove particles. The removal efficiency was dependent on the gap distance between laser focus and surface but in some case surface was damaged by excessive laser intensity. These experiments demonstrate the feasibility of femtosecond laser cleaning using 100㎚ size fluorescence particles on wafer.
ABSTRACT<BR>Ⅰ. 서론<BR>Ⅱ. 실험방법<BR>Ⅲ. 결과 및 고찰<BR>Ⅳ. 결론<BR>참고문헌<BR>
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