UV 레이저를 이용한 다 층막의 선택적 직접가공 공정연구

Selective direct patterning process of multi-layer using UV laser

  A traditional SiNx pattern making processes require PR coating, exposure, develop, etching and PR strip. This causes high equipment cost, running cost and environment pollution. A selective layer direct patterning with mask projection method can be the good alternatives for those typical processes to overcome the above issues. The patterns on a small mask are projected onto a substrate by the almost homogenized beam of UV Excimer laser. This process can ablate only the selected layers clearly by the required depth. The experimental investigations are discussed for obtaining the optimal process condition to ablate selectively the multiple layers in this paper.