다이오드레이저를 이용한 디스플레이 모듈 내 이방성 전도 필름(ACF) 접합 기술에 관한 연구

Study on a New ACF Bonding Methods in LCD Module Using a High Power Diode Laser

  A bonding process between tape-carrier package and a glass panel with anisotropic conductive film (ACF) has been investigated by making use of high power diode laser as a heat source for cure. The results from modeling of process and from optical properties of layers showed that heat absorbed from polyimide film surface and ACF layer is dominant source of curing during laser illumination. Laser ACF bonding has better bonding quality than conventional bonding in view of peel strength, flatness, pressure unbalance and processing time. New ACF bonding processes by making use of high power diode laser are proposed.