다이오드레이저를 이용한 디스플레이 모듈 내 이방성 전도 필름(ACF) 접합 기술에 관한 연구
Study on a New ACF Bonding Methods in LCD Module Using a High Power Diode Laser
- 한국레이저가공학회
- 한국레이저가공학회지
- 한국레이저가공학회지 제8권 제3호
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2005.1221 - 26 (6 pages)
- 65
A bonding process between tape-carrier package and a glass panel with anisotropic conductive film (ACF) has been investigated by making use of high power diode laser as a heat source for cure. The results from modeling of process and from optical properties of layers showed that heat absorbed from polyimide film surface and ACF layer is dominant source of curing during laser illumination. Laser ACF bonding has better bonding quality than conventional bonding in view of peel strength, flatness, pressure unbalance and processing time. New ACF bonding processes by making use of high power diode laser are proposed.
Abstract<BR>1. 서론<BR>2. 이방성 전도 필름 접합 모델링<BR>3. 실험방법<BR>4. 결과 및 고찰<BR>5. 결론<BR>후기<BR>참고문헌<BR>
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