펨토초 레이저 금속 가공시 발생하는 열충격 수치계산 프로그램 개발
Development of numerical-computation program to predict thermal shock induced by fs laser processing of meatals
- 한국레이저가공학회
- 한국레이저가공학회지
- 한국레이저가공학회지 제11권 제1호
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2008.0319 - 24 (6 pages)
- 73
It has been recognized that laser dicing of wafers results in low mechanical strength compared to the conventional sawing techniques. Thermal shock generated by rapid thermal loading is responsible for this problem. This work presents a two-dimensional ultra-short thermoelastic model for numerical simulation of femtosecond laser ablation of metals in the high-fluence regime where the phase explosion is dominant. Laser-induced thermoelastic stress is analyzed for Ni. The results show that the laser-induced thermal shock is large enough to induce mechanical damages.
ABSTRACT<BR>1. 서론<BR>2. 수치모델링<BR>3. 계산결과 및 해석<BR>4. 결론<BR>후기<BR>참고문헌<BR>
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