펨토초 레이저 어블레이션을 이용한 알루미나 세라믹 기판의 정밀 마이크로 드릴링

Precision microdrilling of alumina ceramic substrates by femtosecond laser ablation

  The characteristics of femtosecond laser ablation of Al₂O₃ for precision microfabrication are studied experimentally. Specifically, the process time during femtosecond laser drilling of microholes with sub-100 ㎛ diameter are investigated for varying laser fluence, scan speed and beam path designs like trepanning with continuously changed start points. The accumulation of sub-micrometer size particles within the hole and the deterioration of edge clarity and roundness for decreasing hole diameter are examined and through process optimization the microdrilling with good hole quality is achieved using a femtosecond laser system (repetitionrate 1 ㎑, wavelength 785 ㎚, pulse duration 185 fs).