액상에서의 엑시머 레이저 실리콘 미세가공

Excimer laser micromachining of silicon in liquid environment

  Laser micromachining is promising technique to fabricate the micro-scale device, however, it remains an important challenge that reducing the redeposition of ablated materials around the laser irradiated zone and smoothing the irregular ablated surface, especially in metal and semiconductor processing. To achieve the high-quality micromachined devices, various methods have been developed. Liquid-assisted process can be a good solution to overcome the problems. During the laser ablation process, the liquid around the solid sample dramatically changes the ablation characteristics, such as ablation rate, surface profile, formation of debris, and so on. In this investigation, we conducted the laser micromachining of Si in various liquid environmental conditions, such as liquid types, liquid thickness. In addition, using nanoscale time-resolved shadowgraphy technique, we observed the ablation process in liquid environments to understand the mechanism of liquid-assisted laser processing.