학술저널
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Laser bonding using liquid glass
- 한국레이저가공학회
- 한국레이저가공학회지
- 한국레이저가공학회지 제11권 제3호
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2008.091 - 4 (4 pages)
- 47
A selective laser micro bonding process using liquid glass (methylsilsesquioxane) was developed and the results are analysed. The liquid glass can be solidified with Nd:YAG laser irradiation and it can be applied for joining two glass substrates. A bonding thickness of a few micrometers can be achieved. The appropriate laser power density for this process is around 40-60 ㎾/㎠ and its bonding force is 1000-1200 gf/㎟. This process can be applied for bonding micro devices such as micro bio-sensors or display products. Its advantages and limitations are presented and discussed.
ABSTRACT<BR>1. 서론<BR>2. 실험 방법<BR>3. 결과 및 고찰<BR>4. 결론<BR>후기<BR>참고문헌<BR>
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