KSCN이 함유된 용액에서 레이저유도 에칭된 구리 마이크로 구조물의 특성

Characteristic of a Cu microstructure using laser-assisted etching in aqueous solution with KSCN

  A fabrication technique of copper microgrooves with triangular cross-sectional profile using the laser-assisted etching is introduced. To simplify the complex setup of a conventional objective lens-based laser micromachining, a novel optical fiber-based laser-assisted etching system is proposed to manufacture metallic microgrooves. In the new laser micromachining system, the optical fiber plays a key role as a light waveguide and machining tool. The mixture of H₂SO₄ and H₂O₂ included 0.1% KSCN is chosen as the optimal etchant for manufacturing copper microgroove without background etching in the non-irradiated area. The fabrication of copper microgroove with 100~300㎛ in depth and 100~150㎛ in width is achieved with the proposed machining technique. The grooves fabricated at the optimal process condition have smooth surface and clear edge. The angle of triangular groove is measured to be in the range of 30~50 degree and the aspect ratio of grooves is about 1~2. The overall etching characteristics are investigated with respect to process parameters in this paper.