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Selective laser bonding using liquid glass

A selective laser micro bonding process using liquid glass (Methylsilsesquioxane) was developed and the results are analysed. The liquid glass can be solidified with Nd:YAG laser irradiation and it can be applied for joining two glass substrates. A bonding thickness of a few hundreds~a few micron can be achieved. The appropriate lase power density for this process is around 40~60 kW/㎠ and its bonding force is 1000~1200gf. This process can be applied for bonding micro devices such as micro bio-sensors or display products. Its advantages and limitations are presented and discussed.