LDS를 이용한 폴리머상의 전도성 패턴 형성 연구

A Study on Formation of Conductive pattern on Polymer Using LDS

The LDS(Laser Direct Structuring) process uses thermoplastic polymers with a additive compound that serves as plating seed after the activation by laser. It can realize industry requirement such as miniaturization of electrical component, design flexibility and reduction of production steps. The purpose of this study is to introduce LDS, and to investigate the fundamental mechanism. Also the characteristics of conductive patterns were investigated with respect to laser fluence and intensity. We have used a pulsed fiber laser (wavelength : 1064nm) and copper electroless plating to fabricate conductive patterns. The result showed that laser induced metal-organic complex was caused metalization by electroless copper plating, the critical laser fluence was 1.41 J/㎠ at a scan speed of 1 m/s.