나노초 UV 레이저 응용 IC 기판 소재 조성별 가공 특성
Characteristics of direct laser micromachining of IC substrates using a nanosecond UV laser
- 한국레이저가공학회
- 한국레이저가공학회지
- 한국레이저가공학회지 제15권 제3호
-
2012.097 - 10 (4 pages)
- 261

Dimensions (line/space) of circuits in IC substrates for high-end chips (e.g. CPU, etc.) are anticipated to decrease as small as 10μm/10μm in 2014. Since current etch-based circuit-patterning processes are not able to address the urgent requirement from industry, laser-based circuit patterning processes are under active research in which UV laser is used to engrave embedded circuits patterns into IC substrates. In this paper, we used a nanosecond UV laser to directly fabricate embedded circuit patterns into IC substrates with/without ceramic powders. In experiments, we engraved embedded circuit patterns with dimensions (width/depth) of abut 10μm/10μm and 6μm/6μm into the IC substrates. Due to the recoil pressure occurring during ablation, the circuit patterning of the IC substrates with ceramic powders showed the higher ablation rate.
Abstract
1. 서 론
2. 실험 방법
3. 결과 및 토론
4. 결 론
후 기
References
(0)
(0)