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INVAR 마스크 응용 반도체 기판 소재의 고체 UV 레이저 프로젝션 어블레이션

DPSS UV Laser Projection Ablation of IC Substrates using an INVAR Mask

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Due to the fact that the dimensions of circuit lines of IC substrates have been forecast to reduce rapidly, engraving the circuit line patterns with laser has emerged as a promising alternative. To engrave circuit line patterns in an IC substrate, we used a projection ablation technique in which a metal (INVAR) mask and a DPSS UV laser instead of an excimer laser are used. Results showed that the circuit line patterns engraved in the IC substrate have a width of about 15μm and a depth of 13μm. This indicates that the projection ablation with a metal mask and a DPSS UV laser could feasibly replace the semi-additive process (SAP).

Abstract

1. 서론

2. 실험 방법

3. 결과 및 토론

4. 결론

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