INVAR 마스크 응용 반도체 기판 소재의 고체 UV 레이저 프로젝션 어블레이션
DPSS UV Laser Projection Ablation of IC Substrates using an INVAR Mask
- 한국레이저가공학회
- 한국레이저가공학회지
- 한국레이저가공학회지 제15권 제4호
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2012.1216 - 19 (4 pages)
- 820

Due to the fact that the dimensions of circuit lines of IC substrates have been forecast to reduce rapidly, engraving the circuit line patterns with laser has emerged as a promising alternative. To engrave circuit line patterns in an IC substrate, we used a projection ablation technique in which a metal (INVAR) mask and a DPSS UV laser instead of an excimer laser are used. Results showed that the circuit line patterns engraved in the IC substrate have a width of about 15μm and a depth of 13μm. This indicates that the projection ablation with a metal mask and a DPSS UV laser could feasibly replace the semi-additive process (SAP).
Abstract
1. 서론
2. 실험 방법
3. 결과 및 토론
4. 결론
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