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학술저널

실리콘의 펠티에 효과에 對한 硏究

A Study on the peltier effect of si-Semiconductor

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Being that the melting point of silicon is 1800 J/gr, in this paper it is interested that Si-Semiconductors will be worth using of Peltier effect. For attachment of semiconductor chips, a cure schedule of 2 hours at 200°C has been found to yield a stable and reliable. In the results, it is a semi-permant element and using with a heating element the temperature is up to 200°C over. At the end, it will be possible to improve an excellent elements with a way.

ABSTRACT

1. 序論

2. 基本原理

3. 素子의 製作

4. 實驗 및 檢討

5. 結論

參考文獻

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