노트북 PC용 히트파이프 냉각시스템의 성능에 관한 실험적 연구

An Experimental Study on Performance Test of Notebook PC’s Heat pipe Cooling System Model

The increasing power and particularly the CPU power, coupled with the continuous shrinking size of current notebook PC, have made the thermal management one of the critical factors in the notebook PC design. The heat pipe has become a widely used thermal management tool in the notebook PC industry. Approximately 60% of current notebooks utilize heat pipe in their thermal management solutions. This paper provides a RHE，s(Remote Heat Exchanger) maximum heat transfer rate and the thermal resistance of heat pipe thickness changes and also bending or non-bending types. So, the discussions about the thermal discharge performances of RHE in the range of 1.6 ~ 2.0mm heat pipe thickness are pursued.