반도체소자의 고속마킹검사를 위한 vision system 개발

The development 01 avision system ior fast marking inspection of semiconductor devices

In this paper, we propose the high speed making/surface inspection algorithm, that use adaptive automatic acquisition algorithm and real time matching algorithm of model data. The proposed automatic acquisition algorithm to obtain the adaptive model data extracts the interesting regions to fit in semiconductor characteristics, and create models of several semiconductor regardless of position and type. The proposed real time matching algorithm uses geometrical pattern matching method to minimize effect of external environment of making/surface and only use semiconductor characteristic information. The proposed system has faster processing time than the conventional method. Also the proposed one has a good performance.