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학술저널

반도체 제조장비 및 핵심부품 조사연구

A survey about the semiconauctor equmments & core parts

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This paper describes the state of the art about main equipments for semiconductor manufacturing. Front-end equipments such as stepper, CVD, etcher, ion implantor, RTP, CMP and back-end equipments including wire bonder, Mold/Trim/Form, tester are chosen for this study. Technology trend, parts classification and major manufacture’s DB are surveyed. It could be used to making a strategy for the development of semiconductor equipment.

1 . 서 론

2 . 노광장비

3 . 식각 장비

3. CMP

4 ■결론

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