무연솔더의 솔더링성 연구

A Study of Solderability of Lead-Free Solder

As environmental concerns increasing, the electronics industry is focusing more attention on the lead free solder alternatives. However, the higher melting temperature of lead-free solder was likely to have problems which existing soldering equipment was being constrained. The feasibility of lead-free solder was investigated by addition of the Sn-In-Bi alloy with intermediate melting point. the melting temperature and the wetability of the Sn-In-Bi alloy compared to that of Sn-Pb and Sn-Ag solder. It was found that the zero -cross-time and wetting time of Sn-10In- 5Bi solder was similar to there of Sn-37Pb solder and was increased slightly than those of Sn-3.5Ag solder.