AD(Aerosol Deposition) 방법을 이용한 복합 삼투형 Al₂O₃-Ni 제조공정

Fabrication of Percolative Al₂O₃-Ni Composite Films Employing Aerosol Deposition

Recently, Smart-phone and Electric Devices are need to develop small-technical system. SOP(System on Package) are indispensible to the various Embedded capacitor in the one system package. In this study, Embedded capacitor was inserted in the PCB inner layers to effect PCB surfaces. The method was proved by Aerosol Deposition. Aerosol Deposition was made average 5μm Al₂O₃ composite films and accomplished dielectric constants by Ni-percolation. XRD and SEM proved existed Al₂O₃ and Ni in the composite layers. Ni was existed a little 0.0138~0.0781% by XRD. Al203 dielectric loss was zero by Ni quantity but characteristics of Al₂O₃ showed good devices states.