학술저널
217Plus™을 통한 전자 부품들의 고장률 산출
Failure rates of electronic parts through 217Plus™
- 강원대학교 산업기술연구소
- 산업기술연구
- vol.28
-
2008.09227 - 234 (8 pages)
- 36
Reliability predictions for selected electronic parts using 217-Plus have been performed in this study. 217-Plus has recently developed and may be applied for electronics failure prediction as a surrogate of MIL-HDBK-217. We first briefly reviewed 217-Plus component models. Based on three selected components, predictions using both MIL-HDBK-217 and 217-Plus have been made and the results were compared. Even though the comprehensive conclusion may be drawn from extensive component and system level analyses, the results in this study may provide general insights towards reliability through two specifications.
Abstract
1. 서론
2. MIL-HDBK-217 개요
3. 217-Plus의 개요
4. 고장률 산출
5. 결론
참고문헌
(0)
(0)