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KCI등재 학술저널

테이블 이송속도 변화에 따른 세라믹 재료의 연삭특성에 관한 연구

A Study on the Grinding Characteristic of Ceramic Materials with Change Table Feed Speed

Silicon has been chiefly used to semiconductor industrial integration technology high functional, small light weight, high confidence and economics development a part, electronic products an industrial a ripple effect and change for saving resources, conserve energy, a technology intensive industry secure be located. Silicon with retain a property characteristics of thermal function, mechanical function, electromagnetic function, optical function, energy relation function and so extensive functions of create application expanding the new generation high technology industry a semiconductor equipment parts of one greatly in the sport lighted. Silicon is ceramics an identity mechanical characteristic have to high hardness and chipping. Lower the cost of production used to have been grinding application a diamond memorial stone. In this paper experimental results on the grinding characteristics of silicon are described The higher specific grinding energy and the better ground surface than conventional grinding.

ᅵ. 서 론

II. 세라믹스 재료의 동향

III. 실험장치 및 방법

IV. 실험결과 및 고찰

V. 결 론

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