低質칩으로 製造한 三層 및 單層 파티클보드의 物理的, 機械的 性質

Physical and Mechanical Properties of Three- and Single- Layered Particleboard Composed of Poor-grade Chip

This study was designed to investigate effective composition ratio of unscreened poor-grade pallman face particle including wood flour to commercial core particle in manufacturing 3- and single layered particleboards. Single-layered particle boards were made from the mixture of face and core particle at ratios of 20:80, 30:70, 40:60 and 50:50 while those of 3-layered particleboards were made from the composition ratios of face and back to core 20:80, 30:70, 40:60 and 50:50. Tests were concentrated on mechanical properties and dimensional stabilities. Mechanical properties of 3- and single layered particleboards were not significantly influenced by composition and mixing ratios of face to core particle up to 30:70. Dimensional stability of 3- and single-layered particleboards composed of mixture of face and core particle was similar to that composed entirely of face or core particles. Consequently, unscreened poor-grade face particle was considered to be used without any great problems.