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KCI등재 학술저널

핑거접합방식에 의한 삼나무의 고주파가열 집성판 제조에 관한 연구 (1)

Study on the manufacturing of high-frequency heating Japanese cedar laminated board by finger jointing method (1) - Gluing characteristics of Japnese cedar board by PVAc emulsion adhesives

This experiment was carried out to investigate the gluing characteristics of poly vinyl acetate emulsion adhesive(PVAc) on the Cryptomeria japonica laminated boards. This sample trees are major planting species and have been planted in southern district for a long time. The optimum gluing conditions for laminated board were summarized as follows| the amount of spreading glue, assembly time, clamping pressure, and clamping time for PVAc resin were 200g/㎡, 10min., 5kg/㎠, and 6hrs., respectively, and the relative formulae between extension ratio(x) and block shear strength(y) was y=-9.6x+85.2(R²=0.95).

1. 서론

2. 재료 및 방법

3. 결과 및 고찰

4. 결론

5. 참고문헌

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