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학술대회자료
Super Chip Integration Based on Chip-to-Wafer 3D Integration Technology
Super Chip Integration Based on Chip-to-Wafer 3D Integration Technology
- 한국마이크로전자및패키징학회
- 한국마이크로전자및패키징학회 학술대회자료집
- 2006년도 ISMP 2006
- 2006.10
- 75 - 91 (17 pages)