학술대회자료
Wafer-Level MEMS Packaging : Fundamentals, Reliability Issues and Applications
Wafer-Level MEMS Packaging : Fundamentals, Reliability Issues and Applications
- 한국마이크로전자및패키징학회
- 한국마이크로전자및패키징학회 학술대회자료집
- 2005년도 ISMP
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2005.09231 - 247 (17 pages)
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