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학술대회자료
Effect of Compressive Stresses in Anisotropic Conductive Films (ACFs) on Contact Resistance of Flip Chip Joint
Effect of Compressive Stresses in Anisotropic Conductive Films (ACFs) on Contact Resistance of Flip Chip Joint
- 한국마이크로전자및패키징학회
- 한국마이크로전자및패키징학회 학술대회자료집
- 2004년도 추계 기술심포지움 초록집
- 2004.11
- 14 - 14 (1 pages)