학술대회자료
Effects of Bi on Interfacial Reaction in Electroless Ni-P UBM/ Pb-free Solder Bumps: After Reflow and Aging
Effects of Bi on Interfacial Reaction in Electroless Ni-P UBM/ Pb-free Solder Bumps: After Reflow and Aging
- 한국마이크로전자및패키징학회
- 한국마이크로전자및패키징학회 학술대회자료집
- 2004년도 추계 기술심포지움 초록집
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2004.1159 - 59 (1 pages)
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