커버이미지 없음
학술대회자료
Formation Mechanisms of Various Solidification Defects in Lead-Free Soldering and Their Prevention
Formation Mechanisms of Various Solidification Defects in Lead-Free Soldering and Their Prevention
- 한국마이크로전자및패키징학회
- 한국마이크로전자및패키징학회 학술대회자료집
- 2004년도 ISMP Pb-free solders and the PCB technologies related to Pb-free solders
- 2004.09
- 181 - 199 (19 pages)