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학술대회자료
Electrodeposited Tin Properties & Their Effect on Component Finish Reliability
Electrodeposited Tin Properties & Their Effect on Component Finish Reliability
- 한국마이크로전자및패키징학회
- 한국마이크로전자및패키징학회 학술대회자료집
- 2004년도 ISMP Pb-free solders and the PCB technologies related to Pb-free solders
- 2004.09
- 201 - 209 (9 pages)