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학술대회자료
Intermetallic Compound Formation Behavior and Bump Shear strength at Sn-In Eutectic Solder/UBM Interface
Intermetallic Compound Formation Behavior and Bump Shear strength at Sn-In Eutectic Solder/UBM Interface
- 한국마이크로전자및패키징학회
- 한국마이크로전자및패키징학회 학술대회자료집
- 2003년도 기술심포지움 논문집
- 2003.11
- 99 - 102 (4 pages)