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학술대회자료
Multilayer thin Film technology as an Enabling technology for System-in-Package (SIP) and "Above-IC" Processing
Multilayer thin Film technology as an Enabling technology for System-in-Package (SIP) and "Above-IC" Processing
- 한국마이크로전자및패키징학회
- 한국마이크로전자및패키징학회 학술대회자료집
- 2003년도 International Symposium
- 2003.09
- 93 - 100 (8 pages)