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학술대회자료
Unique New Packaging Technology of Semiconductor by High Performance Encapsulation Epoxy Resin and VPES(Vacuum Printing Encapsulation Systems)
Unique New Packaging Technology of Semiconductor by High Performance Encapsulation Epoxy Resin and VPES(Vacuum Printing Encapsulation Systems)
- 한국마이크로전자및패키징학회
- 한국마이크로전자및패키징학회 학술대회자료집
- 2003년도 International Symposium
- 2003.09
- 217 - 249 (33 pages)