학술대회자료
MOCVD Deposition of AlN Thin Film for Packaging Materials
Sintering Characteristics of Dielectric Material for MCM-C & Electrical Characteristics of Buried Inductor as a function of Dielectric constant
- 한국마이크로전자및패키징학회
- 한국마이크로전자및패키징학회 학술대회자료집
- 1999년도 추계 기술심포지움 논문집
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1999.1159 - 63 (5 pages)
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