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학술대회자료
Critical Cleaning Requirements for Flip Chip Packages
High Integration Packaging Technology for RF Application
- 한국마이크로전자및패키징학회
- 한국마이크로전자및패키징학회 학술대회자료집
- 1999년도 1st Korea-Japan Advanced Semiconductor Packaging Technology Seminar
- 1999.12
- 127 - 154 (28 pages)