학술대회자료
Effect of Cu-contained solders on shear strength of BGA solder joints
Current semiconductor Packaging in Japan
- 한국마이크로전자및패키징학회
- 한국마이크로전자및패키징학회 학술대회자료집
- 1999년도 1st Korea-Japan Advanced Semiconductor Packaging Technology Seminar
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1999.1245 - 61 (17 pages)
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