학술대회자료
The Wetting Properties of UBM-coated Si-wafer to the Lead-free Solders in Si-wafer/Bumps/Glass Flip-Chip Bonding System
Characteristics of Lead Frame Chip Scale Package(LF-CSP)
- 한국마이크로전자및패키징학회
- 한국마이크로전자및패키징학회 학술대회자료집
- 1999년도 1st Korea-Japan Advanced Semiconductor Packaging Technology Seminar
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1999.1263 - 85 (23 pages)
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