학술대회자료
Wettability Analysis of Liquid Phase in Partial Melted Solders Using Wetting Balance
Recent Trend in Multichip Package (MCP) and Multichip Module (MCM)
- 한국마이크로전자및패키징학회
- 한국마이크로전자및패키징학회 학술대회자료집
- 1999년도 1st Korea-Japan Advanced Semiconductor Packaging Technology Seminar
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1999.129 - 43 (35 pages)
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