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학술대회자료
Studies on Ni-Sn Intermetallic Compound and P-rich Ni Layer at the Electroless Nickel (NiP)-Solder Interface and Their Effects on Flip Chip Solder Joint Reliability
The Wetting Properties of UBM-coated Si-wafer to the Lead-free Solders in Si-wafer/Bumps/Glass Flip-Chip Bonding System