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학술대회자료
Effects of Cu or Bi Additions on the Creep Properties of the Sn-3.5Ag Solder Alloys
Au-Au Flip Chip Mounting Technology by NEC
- 한국마이크로전자및패키징학회
- 한국마이크로전자및패키징학회 학술대회자료집
- 2000년도 2nd Korea-Japan Advanceed Semiconductor Packaging Technology Seminar
- 2000.10
- 105 - 129 (25 pages)