학술대회자료
Plating Technology for Lead Free Soldering in Japan
Flip Chip Interconnection Method Applied to Small Camera Module
- 한국마이크로전자및패키징학회
- 한국마이크로전자및패키징학회 학술대회자료집
- 2000년도 2nd Korea-Japan Advanceed Semiconductor Packaging Technology Seminar
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2000.1039 - 45 (7 pages)
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