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학술대회자료
The Thermal Characterization of Chip Size Packages
Wire Bonding Technology for Recent Trend Packaging
- 한국마이크로전자및패키징학회
- 한국마이크로전자및패키징학회 학술대회자료집
- 2000년도 2nd Korea-Japan Advanceed Semiconductor Packaging Technology Seminar
- 2000.10
- 47 - 75 (29 pages)