학술대회자료
Current Status of Semiconductor and Microelectronic Packaging Technology Development in Korea
Impedance Change of Aluminum Pad Coated with Epoxy Molding Compound for Semiconductor Encapsulant
- 한국마이크로전자및패키징학회
- 한국마이크로전자및패키징학회 학술대회자료집
- 2000년도 추계 기술심포지움 논문집
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2000.1143 - 46 (4 pages)
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