커버이미지 없음
학술대회자료
Current Status of Semiconductor and Microelectronic Packaging Technology Development in Korea
Impedance Change of Aluminum Pad Coated with Epoxy Molding Compound for Semiconductor Encapsulant
- 한국마이크로전자및패키징학회
- 한국마이크로전자및패키징학회 학술대회자료집
- 2000년도 추계 기술심포지움 논문집
- 2000.11
- 43 - 46 (4 pages)