학술대회자료
Wafer Bumping Technology
Studies on Ni-Sn Intermetallic Compound and P-rich Ni Layer at the Electroless Nickel (NiP)-Solder Interface and Their Effects on Flip Chip Solder Joint Reliability
- 한국마이크로전자및패키징학회
- 한국마이크로전자및패키징학회 학술대회자료집
- 2000년도 추계 기술심포지움 논문집
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2000.1167 - 71 (5 pages)
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