학술대회자료
EFFECTS OF PROCESS INDUCED DEFECTS ON THERMAL PERFORMANCE OF FLIP CHIP PACKAGE
Thermal and Adhesive Properties of Cu Interconnect Deposited by Electroless Plating
- 한국마이크로전자및패키징학회
- 한국마이크로전자및패키징학회 학술대회자료집
- 2001년도 The IMAPS-Korea Workshop 2001 Emerging Technology on packaging
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2001.07100 - 103 (4 pages)
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