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학술대회자료
Effects of Cu or Bi Additions on the Creep Properties of the Sn-3.5Ag Solder Alloys
Effects of Cu or Bi Additions on the Creep Properties of the Sn-3.5Ag Solder Alloys
- 한국마이크로전자및패키징학회
- 한국마이크로전자및패키징학회 학술대회자료집
- 2001년도 The IMAPS-Korea Workshop 2001 Emerging Technology on packaging
- 2001.07
- 134 - 141 (8 pages)