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학술대회자료
New Flip Chip Attach Technology by Bumps Formed on Substrate
New Flip Chip Attach Technology by Bumps Formed on Substrate
- 한국마이크로전자및패키징학회
- 한국마이크로전자및패키징학회 학술대회자료집
- 2002년도 International Symposium
- 2002.09
- 53 - 68 (16 pages)