학술대회자료
EFFECTS OF PROCESS INDUCED DEFECTS ON THERMAL PERFORMANCE OF FLIP CHIP PACKAGE
EFFECTS OF PROCESS INDUCED DEFECTS ON THERMAL PERFORMANCE OF FLIP CHIP PACKAGE
- 한국마이크로전자및패키징학회
- 한국마이크로전자및패키징학회 학술대회자료집
- 2002년도 추계기술심포지움논문집
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2002.1139 - 47 (9 pages)
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