웨팅밸런스법을 통한 젖음성 평가와 솔더의 젖음 특성
Wettability Evaluation by Wetting Balance Test and Wetting Characteristics of Solders
- 한국마이크로전자및패키징학회
- 마이크로전자 및 패키징학회지
- 제26권 제3호
- : KCI등재후보
- 2019.09
- 1 - 6 (6 pages)
Wettability is an important factor to decide solderability of solder, flux, other soldering-related materials and soldering conditions. The wettability also affects the reliability of solder joint. Wetting balance test is a good method for quantitatively measuring wettability between solder and substrate. The wetting balance test is easy to reproduce the wetting experiment and to measure the wetting time and force. And this test provides wetting curve to calculate the surface tension of the molten solder. Development of new solder has been continued in accordance with various and harsh environment in the electronics industry. In this paper, the principle of wetting balance test and recent research issues including nano-composite solder are explained.
1. 서론
2. 젖음성(Wettablility)
3. 웨팅밸런스 시험법(Wetting balance test)
4. 나노복합 솔더의 젖음성
5. 결론
감사의 글
References