광 PCB의 광 회로층 제작 및 패키징 기술

Fabrication for Optical Layer and Packaging Technology of Optical PCB

Recently, data throughput of smart electric devices increases dramatically. There is a great interest in a new technology which exceeds the limit of electrical transmission method. Optical PCB can supplement the weakness of electrical signal processing, the research for optical PCB is very active. In this paper, we propose the thermal imprint lithography process to fabrication optical layer of optical PCB and experiment to optimize the process conditions. We confirm process time, pressure, process temperature, demolding temperature and fabricate optical interconnection structure which has 45° tilted mirror surface for confirm the interconnection efficiency.