KCI등재
학술저널
Development of the Latest High-performance Acid Copper Plating Additives for Via-Filling & PTH
- 한국마이크로전자및패키징학회
- 마이크로전자 및 패키징학회지
- 제19권 제4호
- : KCI등재후보
- 2012.12
- 39 - 43 (5 pages)
DOI : 10.6117/kmeps.2012.19.4.039
Via-filling plating and through-hole plating are absolutely imperative for manufacturing of printed-wiring board. This Paper is introducing the latest developments of our company worked on the high-performance of acid copper plating additives for them.
1. Introduction
2. Contribution of Additives in Acid Copper Plating
3. Influence of Increase Current Density in Conventional Bath
4. Importance of Leveler for Via-filling and Through-hole Plating
5. TOP LUCINA HV
6. TOP LUCINA HT
7. Conclusion
References