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한국마이크로전자및패키징학회.jpg
KCI등재 학술저널

전자패키지 신뢰성 평가기술의 개요

Introduction of Reliability Test Technology for Electronics Package

DOI : 10.6117/kmeps.2012.19.1.001
  • 3

Reliability technology has been expected to grow rapidly for new types of electronic equipments. We have selected several reliability issues in electronic package to be reviewed. This paper will provide a view of the current state of technological progress in reliability of electronic package in Japan, and will discuss future prospects for the technology.

1. 서론

2. 신뢰성기술의 기초

3. 일본의 신뢰성기술의 최신동향과 과제

4. 신뢰성 평가 사례

5. 결론

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